FI-7876 Cyanide-free electroplated pure gold
The coating obtained by this process has a gold content of 99.99%, a bright appearance, good ductility, good weldability, low contact resistance (0.3m Ω), strong corrosion resistance, and can maintain long-term color retention; Stable plating solution and fast plating speed.
Used for electroplating pure gold on transistors, integrated circuits, and other semiconductor components, suitable for both hanging plating and rolling plating.
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