High deposit brightness Copper Plating FI-970 Bright Acid Copper Plating Process

High deposit brightness Copper Plating FI-970 Bright Acid Copper Plating Process

1. High deposit brightness with exceptional rates of brightening and leveling with no loss of ductility.
2. Easily buffable surface.
3. Ease of bath maintenance and control under production conditions.
4. Addition agents are added on an ampere-hour basis and controlled by hull cell tests.

SOLUTION COMPOSITION

Bath Component Optimum

Copper sulfate: 200 –220 g/L

Pure sulfuric acid: 55 – 70 g/L

Chloride: 100 ppm

FI-97 MU: 4 – 8 ml/L

FI-97 A: 0.4-0.6 ml/L

FI-97 B: 0.4-0.6 ml/L

OPERATION CONDICTIONS

Temperature: 20 -35℃

Cathode Current Density: 1 -6 A/d㎡

Anode Current Density: 0.5-2.5A/d㎡

Voltage: 1.5-6 V