FF-5101 Environmentally friendly Non-Cyanide alkaline thick Copper Process

FF-5101 Environmentally friendly Non-Cyanide alkaline thick Copper Process

1．Features
Good stability of the plating solution and high deposition efficiency; high current efficiency, good
dispersing ability which is especially suitable for seepage carbon and nitrogen treatment in the field
of equipment, and also suitable for the use of continuous copper plating requiring careful
crystallization. The coating is adjustable, and the coating is semi-bright.
cyanide-free formula greatly reduces the pollution of the environment; the plating layer has good
weldability, good conductivity, and good resistance to discolouration; and it can be applied in the
industries of electrical appliances, electronics, telecommunication equipments, and instrument and
meter manufacturing.
1.1. The coating of this process is fine and dense, and the thickness difference of high and low
potential coating is small and uniform.
1.2. Wide range of current density and excellent coverage ability.
1.3. Organic or inorganic impurities have a high tolerance and are easy to control.
1.4. Simple operation control, can hang or roll plating;

2．Process flow:
Pre-treatment activated washing copper plating (FF-5101) (plating other seeds).
Plating solution components:
FF-5101M: 900～1000 ml/L
FF-5101R: Supplement complexing agent
FF-5101Cu: Supplement Cu2+
Temperature: 40～60 ℃
PH: >12
Cathode current density: 0.5～3 A/dm2
Anode electrolytic copper
Anodic area, Cathodic area: 1～2﹕ 1
filter: continuation
stir: Mechanical stirring or cathode movement