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AC-1 Single Component Acid Copper Brightener Electroplated thick copper Electroformed copper

AC-1 Single Component Acid Copper Brightener Electroplated thick copper Electroformed copper

  • Highlight

    Electroformed copper Acid Copper Brightener

    ,

    Single Component Acid Copper Brightener

    ,

    Electroformed Acid Copper Brightener

  • Characteristic
    Electroplated Thick Copper Electroformed Copper
  • Temp
    22~28℃
  • Cl-
    60~100 PPm
  • Place of Origin
    CHINA
  • Brand Name
    FENG FAN
  • Model Number
    AC-1
  • Minimum Order Quantity
    Negotiable
  • Price
    Negotiable
  • Packaging Details
    Standard export packaging
  • Delivery Time
    15-25 work days
  • Payment Terms
    L/C, D/A, D/P, T/T, Western Union, MoneyGram
  • Supply Ability
    200000pcs/day

AC-1 Single Component Acid Copper Brightener Electroplated thick copper Electroformed copper

AC-1 Single Component Acid Copper Brightener Electroplated thick copper Electroformed copper

Properties

 

AC-1 single component acid copper brightener is a high-performance single component acid copper plating brightener developed by our company for continuous copper plating on electroformed copper, coil to coil, and high acid low copper electroplating processes. Its leveling, throwing, and temperature resistance performance have reached the highest level of similar products. Its process characteristics are as follows:

 

1. Good leveling and excellent dispersion performance in low current density areas;

2. It does not contain organic dyes and has low internal stress in the coating;

3. High current density areas are not easy to ignite;

4. All imported intermediates are used, with high purity, few decomposition products, and stable plating solution;

5. Suitable for various processes such as electroforming copper, continuous copper plating on coils, high acid and low copper electroplating, etc;

6. Single component formula, low consumption, and low cost;

7. The process is very stable, easy to operate and maintain, and can last for up to six months without the need for major adjustment.

 

Composition and process conditions of Make-up plating solution

 

Composition and process conditions of Make-up plating solution General Process High acid and low copper process
Standard Range Standard Range
Copper sulfate(CuSO45H2O),g/L 200 180-220 100 80-120
Sulfuric acid(H2SO4,S.G.=1.84),g/L 70 60-80 180 160-200
Chlorine ion,ppm 80 60-100 80 60-100
AC-1 brightener,ml/L 5.0 4.0-6.0 5.0 4.0-6.0
Temperature,℃ 22-28 22-28
Plating bath lined with PP, PVC and other steel tanks
Anode

Phosphorus copper corner

(containing 0.03% -0.06% phosphorus)

Anode/cathode area ratio 2 : 1
Filtration

Continuous cycle filtration,

filtering at least six times per hour

Stirring

Strong uniform air stirring,

with an air volume of 10-30M2/Hr

Cathode current density 1-8 A/dm2
Anode current density 0.5-2.5 A/dm